General survey of material testing and analysis center

Material testing and analysis center of Dalian University of Technology is the university testing and analysis platform built on national “211 Project” and “985 Project” from 2001, and relied on School of Materials Science and Engineering. It is a service institution providing high-level testing and analysis for the university and society. The center has passed the measurement certification of National Certification and Accreditation Administration of the People’s Republic of China and obtained the recognition of China National Accreditation Service for Conformity Assessment. It owns five functions, such as Judicial Authentication Center (trace evidence), Conventional Testing Center, Failure Analysis Arbitration Center, Training Center and Testing Technology Research Center, pursuing the quality policy of science, justice, accuracy and efficiency.

The area of testing center is approximately 815 square meters, and the total value of equipments is about 50 million yuan. The major activities contain chemical composition analysis of materials, microstructure analysis of materials, testing of mechanical properties and physical properties, material microstructure characterization, micro-area composition, surface morphology analysis, polycrystalline phase analysis, the detection of corrosion behavior and so on.

The testing and analysis center has assisted the material discipline to complete 3 “973 Projects”, 5 “863 Projects” and more than 500 Natural Science Fund Projects, and publish over 2000 scientific and technical papers, in which almost 1300 papers are retrieved by SCI and EI. Besides, over 1000 external inspection and analysis projects will be accomplished every year, including more than 100 failure analyzing projects commissioned by enterprises. The center has won National Science and Technology Process Award, Science and Technology Process Awards of Provincial Ministry and so on. It offers a high-level innovation research platform for promoting the development of material science.

Introduction and testing field of equipments

1.Transmission electron microscope(TEM, Tecnai G220 S-Twin, American)

a)Key technical indexes:

1)Pressurizing to 200 KV;

2)Linear resolution is 0.144 nm, point resolution is 0.248 nm;

3)Amplification factor is 250-1100 thousand times.

b)Main test functions:

1)Morphology;

2)Electron diffraction, bright/dark field(B/DF);

3)High resolution transmission electron microscopy(HRTEM);

4)EDX spectrum analysis.

2.Field-emission scanning electron microscope(SUPRA55 German)

a)Key technical indexes:

1)Resolution is0.8nm@15KV,1.6nm@1KVand2.0nm@30KV(VP mode);

2)Amplification factor is 12-500,000 times;

3)Acceleration voltage is 0.02-30 KV;

4)Probe current is 4 pA-20 nA(12 pA-100 nA could be selected);

5)Sample room: 330 mm (φ) x 270 mm (h);

6)Sample platform: 5 axis fully-automatically;

b)Main test functions:

1)Observation of material microstructure morphology;

2)Fracture analysis and failure analysis of materials;

3)Real-time micro-component analysis of materials, quantitative and qualitative composition analysis of elements;

4)Quick multielement surface-scanning and linear-scanning distribution measurements;

5)Phase identification of crystals and grains, analysis of grain size and shape, orientation measurements of crystals and grains.

3. Field emission electron probe（JXA-8530F Plus Japan）

a)Key technical indexes:

1)Analysis of elements range is Be₄-U₉₂;

2)Maximum probe current is 3 μA;

3)Acceleration voltage is 30 Kv;

4)Analysis range of micropoint composition is 0.1~300 μm;

5)Amplification factor is 40-300000 times;

6)EDAXSpectral resolution is 127 Ev.

b)Main test functions:

1)Microcomponent analysis of chemical elements for Be₄-U₉₂;

2)Analytical method: quantitative point analysis, qualitative point analysis, line analysis, surface analysis, state analysis and so on;

3)Surface morphology analysis of materials.

4.Electron microprobe analysis(EMPA-1600 Japan)

a)Key technical indexes:

1)Analysis of elements range is B₅-U₉₂;

2)High X-ray detection angle of 52.5 ℃;

3)Microarea analysis range is 1-100 μm;

4)Amplification factor is 100 thousand times;

5)Secondary electron resolution is 6 nm;

b)Main test functions:

1)Microcomponent analysis of chemical elements for B₅-U₉₂;

2)Analytical method: quantitative point analysis, qualitative point analysis, line analysis, surface analysis, state analysis and so on;

3)Surface morphology analysis of materials.

5.Scanning electron microscope(JSM-5600LV Japan)

a)Key technical indexes:

1)Resolution is 3.5 nm;

2)Acceleration voltage is 0.5-30 KV;

3)Amplification factor is 180-10000 times;

4)Spectral resolution is 133 eV;

b)Main test functions:

1)Surface morphology analysis of materials, such as failure analysis, fracture analysis and so on;

2)Qualitative and quantitative analysis for elements 5B-92U in materials;

3)Distribution testing for elements in materials (including surface-scanning, linear-scanning and surface distribution).

6.X-ray fluorescence spectrometer (XRF-1800 Japan)

a)Key technical indexes:

1)Elements Analysis for 6C-92U;

2)X-ray tube: 4 KW thin window and Rh target;

3)The beam splitter: 10 crystals exchangeable, 5 slits exchangeable, contour functions of high order line and high-level qualitative and quantitative analysis (300°/min);

4)Partial analysis function: 500 μm in analysis diameter;

5)Mapping function: 250 μm in presentation diameter.

b)Main test functions:

1)Qualitative and quantitative analysis for elements 6C-92U;

2)Qualitative analysis and FP quantitative analysis without working curve for kinds of samples, such as solid, powders, liquid and etc;

3)The newly developed qualitative and quantitative method based on high-order lines is added to the mature hardware.

4)Micro-area image display of 250 μm.

7.Hydraulic servo fatigue testing system(MTS Landmark 370.25)

a)Key technical indexes:

1)Load capacity is 250 KN, and dynamic range is 150 mm;

2)The load capacity of hydraulic clamp: +/-250 KN for dynamic and +/-333 KN for static;

3)Temperature range is from -40℃ to 177℃.

b)Main test functions:

1)All kinds of static performance testing for materials;

2)High-cycle fatigue testing;

3)High/low-temperature and low-cycle fatigue testing;

4)Fracture toughness testing;

5)Crack growth experiments.

8.X-ray diffractometer (XRD-6000 Japan)

a)Key technical indexes

1)Scanning radius is 185 mm;

2)Minimum step angle is 0.001℃;

3)Angle repeatability is +0.001℃;

4)Scanning range is from -6 to 163℃;

5)Equipped with stress meter.

b)Main test functions:

1)Crystal structure analysis of materials;

2)Analysis to the fields of metal, nonmetal, oxide, minerals, food, biological products, machinery, electronics, ceramics and etc;

3)The measurement of material stress and accurate measurement of residual stress.

9.X-ray diffractometer(Empyrean Netherlands)

a)Key technical indexes

1)Ceramic X-ray tube: maximum power is 2.2 KW(Cu target);

2)Reproducibility of goniometer is 0.0001°;

3)Minimum controllable step is 0.0001°;

4)Maximum counting rate of PIXcel3D super detector is more than 109 cps;

5)5-axis sample platform: correcting samples in five directions.

b)Main test functions

1)Conventional phase analysis;

2)Phase analysis of thin films;

3)Texture measurement;

4)Stress analysis.

10.OLYMPUS Confocal laser scanning microscope (OLS4000 Japan)

a)Key technical indexes

1)Equipped objectives of 5×, 10×, 20×, 50× and 100×; the size of ultrasonic electric objective table is 100×100 mm; range of optical zoom is 1-8 times;

2)Amplification factor is 100-17200 times, horizontal resolution is 0.12 μm, and Z-axis resolution is 0.8 nm.

3)The largest vision of microscope is 5120×5120 mm; a maximum of 500 images could be automatically puzzled.

b)Main test functions:

High-resolution two-dimensional surface microscopic morphology could be obtained; observable three-dimensional surface shape and morphology with submicron degree (0.2 μm) of specimens; varieties of measurable minute size, such as volume, area, grains, film thickness, depth, length, line roughness, surface roughness and so on.

11.DSC differential thermal analysis system(DSC822/TGA/sdta851 America)

a)Key technical indexes:

1)DSC822: temperature range is from -65℃to 700℃; temperature accuracy is ±0.1℃;heating rate is 90℃/min;

2)TGA: temperature range is from room temperature to 1600℃; temperature accuracy is ±0.1℃;heating rate is 100℃/min.

b)Main test functions:

1)The analysis of crystalline transition, melting, evaporation, dehydration, biochemistry, absorption, glass transition, liquid-crystalline transition, solidification, catalysis, thermal stability, drug purity and so on;

2)Material identification, such as the identification of single materiality among resin mixtures;

3)Thermodynamics research of materials;

4)Material structure and its thermodynamics and dynamics research;

12.Metallographic microscope(MEF-4 Germany)

a)Key technical indexes:

1)Configuration: bright field, dark field, polarized light and differential interference contrast and interference (stripes) function;

2)Macro attachments and projection screen;

3)Camera system: there are 135, 4×5 and 120 films with automatic metering system and automatic exposure system;

4)Micromagnification is from 20× to 1875×.

5)Low magnification macroscopic analysis is from 1 to 4 times;

6)High magnification microscopic analysis is from 12 to 1875 times.

b)Main test functions:

It is mainly applied to reflective materials to measure the tissue morphology, tissue structure of metallic materials, the quality and thickness of surface coating, chip structure, tissue and depth of seepage layer, etc.

13.UV/VIS/NIR Spectrophotometer(Lambda950 America)

a)Key technical indexes:

Equipped with PTFE coating integral ball(150 mm) and universal reflection/ transmission accessory (URA).

The spectrum range: 175-3300 nm; bandwidth: ≤0.05 nm; stray light: ≤0.00007%T; linear range: 8 A; wavelength accuracy: ±0.08 nm; wavelength repeatability: <0.005 nm; photometer accuracy: ±0.0003 A; photometer repeatability: <0.00008 A.

b)Main test functions:

Transmission/ diffuse transmission/ reflection/ scattering test for various samples in visible, ultraviolet and near infrared spectral region.

14.Fourier infrared spectrometer(VERTEX 70 Germany)

a)Key technical indexes:

Equipped with middle/near infrared integral ball,absolute reflective rate accessory, absolute transmittance rate accessory, variable-angle ATR reflection accessory, variable swept angle accessory and pure diamond ATR accessory.

The spectrum range: 8,000-350 cm^-1; resolution: superior to 0.4 cm^-1; wavenumber accuracy: superior to 0.01 cm^-1; light transmittance accuracy: superior to 0.1%T; scanning speed: 0.1-10 cm/sec opd, 16 gears.

b)Main test functions:

Transmission/ diffuse transmission/ reflection/ scattering test for various samples in infrared spectral region to measure the functional groups of materials and the structure and chemical bonds of compounds.

15.Direct-reading spectrometer(PDA-5500ⅡJapan)

a)Key technical indexes:

1)Diffraction grating of light splitting unit: curvature radius of 600 mm;

2)Wavelength range: 121-589 nm;

3)Photometry device: PDA photometry/ time-decomposition photometry.

b)Main test functions:

As a chemical composition analysis device to quickly analyze elements: Fe,C, S, P, Si, Mn, CrI, CrII, NiI, NiII, V, Mo, Al, Cu, Ti, Pb, Zn, Mg.

16.Superconducting strong-magnetic-field device(JMT100 Japan)

a)Key technical indexes:

1)The maximum magnetic induction intensity is 10 T(tesla), and the adjustable range is from 1 to 10 T;

2)The size of processing cavity isϕ100×460 mm;

3)The accelerating time from 0 to 10 T is 12 min.

b)Main test functions:

1)Strong magnetic heat treatment for materials;

2)Strong magnetic control for metal solidification;

3)Strong magnetic treatment for biological embryo;

4)Strong magnetic treatment for plating, corrosion, biological pharmaceuticals, medical materials, etc.

17.Focused ion beam (Helios G4 UX America)

a)Key technical indexes:

Ion beam:

1)Liquid Ga ion source;

2)Accelerating voltage: 500 V-30 kV;

3)Beam intensity: 0.1 pA-65 nA;

4)Cross point resolution: 4.0 nm @ 30kV;

5)Equipped with sedimentary gases, such as W, C, and Pt;

6)Equipped with enhanced etching gas, such as I₂and XeF.

Electron beam:

1)Resolution: 0.6nm @ 15kV, 0.7nm @ 1kV, 1.0 nm @ 500V;

2)Accelerating voltage: 200 V-30 kV;

3)Sample room: inner diameter of 379 mm;

4)Sample table: five axis motor drive sample table.

b)Main test functions:

1)Electron beam/ ion beam imaging to observe the microsurface; equipped with energy spectrometer and EBSD system;

2)Real-time observation of samples produced by ion beam processing with high resolution scanning electron microscope function;

3)Precise cutting: transmission electron microscope sample preparation;

4)Ion beam deposition: equipped with sedimentary gases, such as W, C, and Pt;

5)Ion beam etching: equipped with enhanced etching gas, such as I₂and XeF; enhanced etching or selective etching combining with corrosive gases to accelerate cutting efficiency or remove selective materials.